CEA is a French government-funded technological research organization. Drawing on its excellence in fundamental research, CEA activities cover three main areas: Energy, Information and Health Technologies, and Defense and Security. As a prominent player in the European Research Area, with an internationally acknowledged level of expertise in its core competencies, CEA is engaged in collaborative projects with leading academic and industrial partners from around the world.
Within CEA, the Technological Research Division boasts three operational institutes providing cutting edge research to improve industrial competitiveness through technology transfer: the CEA-Leti, focused on microelectronics, information & healthcare technologies, the CEA-List dedicated to technologies for digital systems, and the CEA-Liten centered on new energy technologies.
CEA- Leti serves as a bridge between basic research and industry. His mission is to create value and innovate with industry. The core competencies of Leti bring it in the core of the IoT and High Computing world combining low power solution, nanoelectronics, sensors, connectivity technologies and security. Backed by its portfolio of 2,800 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions and their high tech image. The Institute has launched 54 startups to date. Its 8,500m² of latest-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices.With a staff of more than 1,800 including 250 PhDs and post-docs, Leti is based in Grenoble, France, and has offices in Silicon Valley and Tokyo.
In the frame of the CONVERGENCE project, three departments will be involved:
- DSYS, the System division is dedicated to research and development of sensors and their integration within consumer or industry related context. The competences rely on both the new sensor development and characterisation as well as signal processing for dedicated use (e.g. low power consumption and context capture including physiological monitoring).
- DCOS, the silicon component division specialized in the field of CMOS integration and MEMS. In this project, the focus will on silicon integration techniques usually used for 3D integration, which will be adapted for integration of silicon chip on flexible substrates.
- DTNM, specialized in large area printed electronics: sensors and platforms developments on flexible (glass and polymer) substrates.